Features
1. Motherboard PCB fixture, CPU NAND PCIE glue remove, fingerprint repair fxture Multi-Function in one
2. Uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage, pure copper heat conduction block does not directly contact the main board
3. PCB repair platform added CPU positioning structure. No manual positioning needed, improve the success rate. Added motherboard layer separation and positioning installation structure.
4. Designed with precision positioning column, it will makes efficient repairs for separating, soldering and installation.
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